Vertical soldering free RF connector

We have launched a new series of vertical solder free RF connectors, which break through the industry practice of traditional RF connectors relying on soldering assembly. Through a precision mechanical locking structure, PCB board end zero soldering fast vertical interconnection is achieved, covering the entire high-frequency frequency range from general RF to millimeter wave. It balances high-density layout adaptability and long-term reliability, providing an efficient and low loss new interconnection solution for high-speed high-frequency circuit testing and integration scenarios.

Welding free products have excellent standing wave ratio performance in the corresponding frequency band, with insertion loss controlled at an extremely low level, which can minimize reflection and attenuation during high-frequency signal transmission, ensuring the integrity of signal transmission and the accuracy of measurement results.

Core product advantages

✅  Soldering free rapid assembly: PCB can be vertically fixed without soldering, avoiding performance degradation caused by soldering heat damage and solder climb. Assembly efficiency is increased by more than 80% compared to traditional soldering solutions, supporting multiple disassembly and reuse, significantly reducing maintenance costs in the later stage.

✅  High density layout compatibility: The compact flange structure supports extremely small spacing array layout, which can integrate more interconnect channels in limited PCB space, perfectly adapting to the high-density layout requirements of compact high-frequency test boards.

✅  High reliability contact design: Adopting a petal shaped multi-point flexible contact mechanism, it can offset the connection deviation caused by assembly tolerances, and has excellent anti vibration and anti impact performance. After long-term insertion and removal, the performance does not significantly deteriorate, meeting the strict industrial use standards.

✅  Low loss signal transmission: The contact area adopts beryllium copper gold plating technology, combined with precision impedance matching design, which achieves high fidelity signal transmission across the entire frequency band and can significantly reduce system errors in high-frequency measurement scenarios.

Landing application scenarios

This series of products can be widely adapted to various industry scenarios:

• Research and development of millimeter wave high-frequency signal testing board and high-speed SERDES prototype verification board
• 5G/6G communication RF module, integration of microwave and millimeter wave telecommunications equipment
• High density board to board vertical interconnection system, miniaturized RF transceiver components
• Batch production automation testing, mass production testing stations with high requirements for assembly efficiency